Display device with integrated touch screen

ABSTRACT

Disclosed is a display device with integrated touch screen, which can prevent a first touch electrode or a second touch electrode from being short-circuited with a bridge electrode through an opening. The display device includes first electrodes on a first substrate, a light emitting layer on the first electrodes, a second electrode on the light emitting layer, an encapsulation layer on the second electrode, a bridge electrode and a dummy electrode on the encapsulation layer, an insulation layer covering the bridge electrode and the dummy electrode, and a first touch electrode and a second touch electrode on the insulation layer. The first touch electrode is electrically connected to the bridge electrode, and bridge electrode is spaced apart from the dummy electrode.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application claims the benefit of the Korean Patent Application No.10-2017-0067889, filed May 31, 2017, which is hereby incorporated byreference as if fully set forth herein.

BACKGROUND Technical Field

The present disclosure relates to a display device with integrated touchscreen and a method of manufacturing the same.

Description of the Related Art

With the advancement of information-oriented society, variousrequirements for display devices for displaying an image are increasing.Consequently, various display devices such as liquid crystal display(LCD) devices, plasma display panel (PDP) devices, and organic lightemitting display devices are being used recently. The organic lightemitting display devices have characteristics where driving is performedwith a low voltage, a thickness is thin, a viewing angle is good, and aresponse time is fast.

The organic light emitting display devices each include a display panelwhich includes a plurality of data lines, a plurality of scan lines, anda plurality of pixels respectively provided in a plurality of pixelareas defined by intersections of the data lines and the scan lines, ascan driver which respectively supplies scan signals to the scan lines,and a data driver which respectively supplies data voltages to the datalines. Each of the pixels includes an organic light emitting device, adriving transistor which controls the amount of current supplied to theorganic light emitting device according to a voltage of a gateelectrode, and a scan transistor which supplies a data voltage of acorresponding data line to the gate electrode of the driving transistorin response to a scan signal of a corresponding scan line.

Recently, the organic light emitting display devices are implemented asdisplay devices with integrated touch screen, which includes a touchscreen panel capable of sensing a user touch. In this case, the organiclight emitting display devices function as touch screen devices.Recently, the touch screen devices are applied to monitors such asnavigations, industrial terminals, notebook computers, financialautomation equipment, and game machines, portable terminals such asportable phones, MP3 players, personal digital assistants (PDAs),portable multimedia players (PMPs), play station portables (PSPs),portable game machines, digital multimedia broadcasting (DMB) receivers,and tablet personal computers (PCs), and home appliances such asrefrigerators, microwave ovens, and washing machines. Since all userscan easily manipulate the touch screen devices, the application of thetouch screen devices is being progressively expanded.

Display devices with integrated touch screen include a plurality offirst touch electrodes, a plurality of second touch electrodes, and aplurality of bridge electrodes for connecting the first touch electrodesto the second touch electrodes, which are provided in a display panel.The first touch electrodes may be Tx electrodes, and the second touchelectrodes may be Rx electrodes.

The first touch electrodes and the second touch electrodes may beprovided on the same layer, and the bridge electrodes may be provided ona layer which differs from a layer on which the first touch electrodesand the second touch electrodes are provided. Each of the bridgeelectrodes is provided in an island shape, but since the bridgeelectrodes are spaced apart from each other by a certain interval, thebridge electrodes can be over-etched in an etching process of patterningthe bridge electrodes.

In detail, as shown in FIG. 1, a plurality of bridge electrodes BE maybe provided in a three-layer structure including first to third bridgeelectrodes BE1 to BE3. For example, the first to third bridge electrodesBE1 to BE3 may be provided in a three-layer structure of titanium(Ti)/aluminum (Al)/Ti. If Al is higher than Ti in degree of etchingwhich is performed by an etching gas or an etchant in an etchingprocess, Al can be over-etched in comparison with Ti, and anover-etching region of Al can be provided in a reverse taper shape.Particularly, a side surface of the second bridge electrode BE2 can beeasily etched as in FIG. 1. Therefore, even when an insulation layer INSis provided on the bridge electrodes BE, an opening OP may be providedin the over-etching region as in FIG. 1. Therefore, even when aplurality of first touch electrodes or a plurality of second touchelectrodes are provided on the insulation layer INS, a first touchelectrode or a second touch electrode is short-circuited with a bridgeelectrode BE through the opening OP, which exposes portions of thesecond bridge electrode BE2. In this case, the first touch electrode isconnected to the bridge electrode BE, but if the second touch electrodeis short-circuited with the bridge electrode BE through the opening OP,a display device with integrated touch screen is difficult to normallysense a touch.

BRIEF SUMMARY

Accordingly, the present disclosure is directed to provide a displaydevice with integrated touch screen that substantially obviates one ormore problems due to limitations and disadvantages of the related art.

In one or more embodiments, the present disclosure provides a displaydevice with integrated touch screen, which prevents a first touchelectrode or a second touch electrode from being short-circuited with abridge electrode through an opening.

Additional advantages and features of the disclosure will be set forthin part in the description which follows and in part will becomeapparent to those having ordinary skill in the art upon examination ofthe following or may be learned from practice of the disclosure. Theobjectives and other advantages of the disclosure may be realized andattained by the structure particularly pointed out in the writtendescription and claims hereof as well as the appended drawings.

To achieve these and other advantages and in accordance with the purposeof the disclosure, as embodied and broadly described herein, in oneembodiment a display device with integrated touch screen is provided,the display device including first electrodes on a first substrate, alight emitting layer on the first electrodes, a second electrode on thelight emitting layer, an encapsulation layer on the second electrode, abridge electrode and a dummy electrode on the encapsulation layer, aninsulation layer covering the bridge electrode and the dummy electrode,and a first touch electrode and a second touch electrode on theinsulation layer. The bridge electrode is electrically connected to thefirst touch electrode, and is spaced apart from the dummy electrode.

In another embodiment, the present disclosure provides a display devicewith integrated touch screen, the display device comprising: firstelectrodes on a first substrate; a light emitting layer on the firstelectrode; a second electrode on the light emitting layer; anencapsulation layer on the second electrode; a touch buffer layer on theencapsulation layer; a bridge electrode having a multi-layer structureand a dummy electrode on the touch buffer layer; an insulation layercovering the bridge electrode and the dummy electrode; and a first touchelectrode and a second touch electrode on the insulation layer, whereinthe bridge electrode is electrically connected with the first touchelectrode, the bridge electrode is disposed adjacent to the dummyelectrode, and a side surface of the bridge electrode is provided in apositive taper shape.

In another embodiment of the present disclosure, there is provided amethod of manufacturing a display device with integrated touch screen,the method including forming a first electrode on a first substrate,forming a light emitting layer on the first electrode, forming a secondelectrode on the light emitting layer, forming an encapsulation layer onthe second electrode, forming a bridge electrode and a dummy electrodeon the encapsulation layer, the bridge electrode being spaced apart fromthe dummy electrode, forming an insulation layer covering the bridgeelectrode and the dummy electrode, and forming a first touch electrodeand a second touch electrode on the insulation layer.

In one or more embodiments, the forming of the insulation layer maycomprise forming a first contact hole, which passes through theinsulation layer and exposes the bridge electrode, and a second contacthole exposing the dummy electrode.

In one or more embodiments, the forming of the first touch electrode andthe second touch electrode may comprise: forming the first touchelectrode on the first contact hole so that the first touch electrode isconnected to the bridge electrode through the first contact hole; andforming the first touch electrode or the second touch electrode on thesecond contact hole so that the first touch electrode or the secondtouch electrode is connected to the dummy electrode through the secondcontact hole.

In one or more embodiments, the method may further comprise forming anovercoat layer on the first and second touch electrodes for planarizinga step height caused by the bridge electrode, the dummy electrode, andthe first and second touch electrodes.

In one or more embodiments, the forming of the insulation layer maycomprise forming a contact hole, which passes through the insulationlayer and exposes the bridge electrode, wherein the forming of the firsttouch electrode and the second touch electrode may comprise forming thefirst or second touch electrode on the contact hole so that the first orsecond touch electrode is connected to the bridge electrode through thecontact hole.

In one or more embodiments, the forming of the bridge electrode and thedummy electrode may comprise forming the bridge electrode and the dummyelectrode of a same material on a same layer.

In another aspect of the present disclosure, there is provided a methodof manufacturing a display device with integrated touch screen, themethod comprising: forming first electrodes on a first substrate,forming a light emitting layer on the first electrodes, and forming asecond electrode on the light emitting layer; forming an encapsulationlayer on the second electrode; forming a touch buffer layer on theencapsulation layer; forming a bridge electrode having a multi-layerstructure and a dummy electrode on the touch buffer layer; forming aninsulation layer covering the bridge electrode and the dummy electrode;and forming a first touch electrode and a second touch electrode on theinsulation layer, wherein the forming of the bridge electrode and thedummy electrode comprises forming the bridge electrode to beelectrically connected with the first or second touch electrode, formingthe bridge electrode to be disposed adjacent to the dummy electrode, andforming a side of the bridge electrode to be a positive taper shape.

In one or more embodiments, the forming of the bridge electrode and thedummy electrode may comprise forming the dummy electrode as a floatingelectrode.

In one or more embodiments, the forming of the bridge electrode and thedummy electrode may comprise forming the bridge electrode and the dummyelectrode of a same material on a same layer.

It is to be understood that both the foregoing general description andthe following detailed description of the present disclosure areexemplary and explanatory and are intended to provide furtherexplanation of the disclosure as claimed.

BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWINGS

The accompanying drawings, which are included to provide a furtherunderstanding of the disclosure and are incorporated in and constitute apart of this application, illustrate embodiments of the disclosure andtogether with the description serve to explain the principle of thedisclosure. In the drawings:

FIG. 1 is an exemplary diagram illustrating an example where an openingis provided when a bridge electrode having a three-layer structure isover-etched;

FIG. 2 is a perspective view illustrating a display device withintegrated touch screen according to an embodiment of the presentdisclosure;

FIG. 3 is a block diagram illustrating a display device with integratedtouch screen according to an embodiment of the present disclosure;

FIG. 4 is a cross-section view of one side of a display panel of FIG. 2;

FIG. 5 is a plan view illustrating first and second touch electrodes,bridge electrodes, and first and second touch lines of a display devicewith integrated touch screen according to an embodiment of the presentdisclosure;

FIG. 6 is an enlarged view illustrating in detail an example of a regionA of FIG. 5, in accordance with one or more embodiments of the presentdisclosure;

FIG. 7A is a plan view illustrating bridge electrodes and dummyelectrodes in FIG. 6;

FIG. 7B is a plan view illustrating first and second touch electrodes inFIG. 6;

FIG. 8 is a cross-sectional view illustrating an example taken alongline I-I′ of FIG. 6;

FIG. 9 is a flowchart illustrating a method of manufacturing a displaydevice with integrated touch screen according to an embodiment of thepresent disclosure;

FIGS. 10A to 10D are cross-sectional views for describing a method ofmanufacturing a display device with integrated touch screen according toan embodiment of the present disclosure;

FIG. 11 is an enlarged view illustrating in detail another example ofthe region A of FIG. 5, in accordance with one or more embodiments ofthe present disclosure;

FIG. 12 is a cross-sectional view illustrating an example taken alongline II-II′ of FIG. 11;

FIG. 13 is a flowchart illustrating a method of manufacturing a displaydevice with integrated touch screen according to another embodiment ofthe present disclosure; and

FIGS. 14A and 14B are cross-sectional views for describing a method ofmanufacturing a display device with integrated touch screen according toanother embodiment of the present disclosure.

DETAILED DESCRIPTION

Reference will now be made in detail to the exemplary embodiments of thepresent disclosure, examples of which are illustrated in theaccompanying drawings. Wherever possible, the same reference numberswill be used throughout the drawings to refer to the same or like parts.

Advantages and features of the present disclosure, and implementationmethods thereof will be clarified through following embodimentsdescribed with reference to the accompanying drawings. The presentdisclosure may, however, be embodied in different forms and should notbe construed as limited to the embodiments set forth herein. Rather,these embodiments are provided so that this disclosure will be thoroughand complete, and will fully convey the scope of the present disclosureto those skilled in the art.

A shape, a size, a ratio, an angle, and a number disclosed in thedrawings for describing embodiments of the present disclosure are merelyan example, and thus, the present disclosure is not limited to theillustrated details. Like reference numerals refer to like elementsthroughout. In the following description, when the detailed descriptionof the relevant known function or configuration is determined tounnecessarily obscure the important point of the present disclosure, thedetailed description will be omitted.

In a case where ‘comprise,’ ‘have,’ and ‘include’ described in thepresent specification are used, another part may be added unless ‘only˜’is used. The terms of a singular form may include plural forms unlessreferred to the contrary.

In construing an element, the element is construed as including an errorrange although there is no explicit description.

In describing a position relationship, for example, when a positionrelation between two parts is described as ‘on˜,’ ‘over˜,’ ‘under˜,’ and‘next˜,’ one or more other parts may be disposed between the two partsunless exclusively limited by terms such as ‘just’ or ‘direct’.

In describing a time relationship, for example, when the temporal orderis described as ‘after˜,’ ‘subsequent˜,’ ‘next˜,’ and ‘before˜,’ a casewhich is not continuous may be included unless ‘just’ or ‘direct’ isused.

It will be understood that, although the terms “first,” “second,” etc.may be used herein to describe various elements, these elements shouldnot be limited by these terms. These terms are only used to distinguishone element from another. For example, a first element could be termed asecond element, and, similarly, a second element could be termed a firstelement, without departing from the scope of the present disclosure.

An X axis direction, a Y axis direction, and a Z axis direction shouldnot be construed as only a geometric relationship where a relationshiptherebetween is strictly vertical, and may denote having a broaderdirectionality within a scope where elements of the present disclosureoperate functionally.

The term “at least one” should be understood as including any and allcombinations of one or more of the associated listed items. For example,the meaning of “at least one of a first item, a second item, and a thirditem” denotes the combination of all items proposed from two or more ofthe first item, the second item, and the third item as well as the firstitem, the second item, or the third item.

Features of various embodiments of the present disclosure may bepartially or overall coupled to or combined with each other, and may bevariously inter-operated with each other and driven technically as thoseskilled in the art can sufficiently understand. The embodiments of thepresent disclosure may be carried out independently from each other, ormay be carried out together in co-dependent relationship.

Hereinafter, exemplary embodiments of the present disclosure will bedescribed in detail with reference to the accompanying drawings.

FIG. 2 is a perspective view illustrating a display device withintegrated touch screen according to an embodiment of the presentdisclosure. FIG. 3 is a block diagram illustrating a display device withintegrated touch screen according to an embodiment of the presentdisclosure.

Referring to FIGS. 2 and 3, the display device with integrated touchscreen 100 according to an embodiment of the present disclosure mayinclude a display panel 110, a scan driver 120, a data driver 130, atiming controller 160, a host system 170, a touch driver 180, and atouch coordinate calculator 190.

The display device with integrated touch screen according to anembodiment of the present disclosure may be implemented with an LCDdevice, a field emission display (FED) device, a PDP device, a lightemitting display device including an organic light emitting displaydevice (OLED) and a micro LED (light emitting device) display device, anelectrophoresis display (EPD) device, or the like. Hereinafter, anexample where the display device with integrated touch screen accordingto an embodiment of the present disclosure is implemented with anorganic light emitting display device will be described, but the presentdisclosure is not limited thereto.

The display panel 110 may include a first substrate 111 and a secondsubstrate 112. The second substrate 112 may be an encapsulationsubstrate. The first substrate 111 may be a plastic film, a glasssubstrate, or the like. The second substrate 112 may be a plastic film,a glass substrate, an encapsulation film (a protective film), or thelike.

The display panel 110 may include a display area where a plurality ofpixels P are provided to display an image. A plurality of data lines D1to Dm (where m is a positive integer equal to or more than two) and aplurality of scan lines S1 to Sn (where n is a positive integer equal toor more than two) may be provided. The data lines D1 to Dm may beprovided to intersect the scan lines S1 to Sn. The term “intersect” isused herein to mean that one element crosses over or overlaps anotherelement, and does not necessarily mean that the two elements contacteach other. For example, the data lines D1 to Dm and the scan lines S1to Sn may intersect each other, but may be physically separated from oneanother, for example, by one or more layers or elements providedtherebetween. The pixels P may be respectively provided in a pluralityof areas defined by an intersection structure of the data lines D1 to Dmand the scan lines S1 to Sn.

Each of the pixels P of the display panel 110 may be connected to one ofthe data lines D1 to Dm and one of the scan lines S1 to Sn. Each of thepixels P of the display panel 110 may include a driving transistor whichcontrols a drain-source current according to a data voltage applied to agate electrode, a scan transistor which is turned on by a scan signal ofa scan line and supplies the data voltage of a data line to the gateelectrode of the driving transistor, a light emitting device such as anorganic light emitting diode (OLED) which emits light with thedrain-source current of the driving transistor, and a capacitor whichstores a voltage at the gate electrode of the driving transistor.Therefore, each of the pixels P may emit light with a current suppliedto the OLED.

The scan driver 120 may receive a scan control signal GCS from thetiming controller 160. The scan driver 120 may supply scan signals tothe scan lines S1 to Sn according to the scan control signal GCS.

The scan driver 120 may be provided in a non-display area outside oneside or both sides of a display area of the display panel 110 in a gatedriver-in panel (GIP) type. Alternatively, the scan driver 120 may bemanufactured as a driving chip and may be mounted on a flexible film,and moreover, may be attached on the non-display area outside the oneside or the both sides of the display area of the display panel 110 in atape automated bonding (TAB) type.

The data driver 130 may receive digital video data DATA and a datacontrol signal DCS from the timing controller 160. The data driver 130may convert the digital video data DATA into analog positive/negativedata voltages according to the data control signal DCS and may supplythe data voltages to the data lines. That is, pixels to which the datavoltages are to be supplied may be selected by the scan signals of thescan driver 120, and the data voltages may be supplied to the selectedpixels.

The data driver 130, as in FIG. 2, may include a plurality of sourcedrive integrated circuits (ICs) 131. Each of the plurality of sourcedrive ICs 131 may be mounted on a flexible film 140 in a chip-on film(COF) type or a chip-on plastic (COP) type. The flexible film 140 may beattached on a plurality of pads provided in the non-display area of thedisplay panel 110 by using an anisotropic conductive film, and thus, theplurality of source drive ICs 131 may be connected to the pads.

The flexible film 140 may be provided in plurality, and a circuit board150 may be attached on the flexible films 140. A plurality of circuitsrespectively implemented as driving chips may be mounted on the circuitboard 150. For example, the timing controller 160 may be mounted on thecircuit board 150. The circuit board 150 may be a printed circuit board(PCB) or a flexible printed circuit board (FPCB).

The timing controller 160 may receive the digital video data DATA andtiming signals from the host system 170. The timing signals may includea vertical synchronization signal, a horizontal synchronization signal,a data enable signal, a dot clock, etc. The vertical synchronizationsignal may be a signal that defines one frame period. The horizontalsynchronization signal may be a signal that defines one horizontalperiod necessary for supplying data voltages to pixels of one horizontalline of the display panel 110. The data enable signal may be a signalthat defines a period where valid data is input. The dot clock may be asignal that is repeated at a certain short period.

The timing controller 160 may generate the data control signal DCS forcontrolling an operation timing of the data driver 130 and the scancontrol signal GCS for controlling an operation timing of the scandriver 120 so as to control the operation timing of each of the scandriver 120 and the data driver 130, based on the timing signals. Thetiming controller 160 may output the scan control signal GCS to the scandriver 120 and may output the digital video data DATA and the datacontrol signal DCS to the data driver 130.

The host system 170 may be implemented as a navigation system, a set-topbox, a DVD player, a blue-ray player, a personal computer (PC), a hometheater system, a broadcasting receiver, a phone system, or the like.The host system 170 may include a system-on chip (SoC) with a scalerembedded therein and may convert the digital video data DATA of an inputimage into a format suitable for displaying the image on the displaypanel 110. The host system 170 may transmit the digital video data DATAand the timing signals to the timing controller 160.

In addition to the data lines D1 to Dm and the scan lines S1 to Sn, aplurality of first and second touch electrodes may be provided in thedisplay panel 110. The first touch electrodes may be provided tointersect, e.g., to overlap with, the second touch electrodes. The firsttouch electrodes may be connected to a first touch driver 181 through aplurality of first touch lines T1 to Tj (where j is a positive integerequal to or more than two). The second touch electrodes may be connectedto a second touch driver 182 through a plurality of second touch linesR1 to Ri (where i is a positive integer equal to or more than two). Aplurality of touch sensors may be respectively provided in intersectionregions of the first touch electrodes and the second touch electrodes.In an embodiment of the present disclosure, each of the touch sensorsmay be exemplarily implemented with a mutual capacitor, but is notlimited thereto. A disposition structure of the first and second touchelectrodes will be described below in detail with reference to FIG. 5.

The touch driver 180 may supply a driving pulse to the first touchelectrodes through the first touch lines T1 to Tj and may sense chargingvariations of the touch sensors through the second touch lines R1 to Ri.That is, in FIG. 3, it is described that the first touch lines T1 to Tjare Tx lines through which the driving pulse is supplied, and the secondtouch lines R1 to Ri are Rx lines through which the charging variationsof the touch sensors are respectively sensed.

The touch driver 180 may include a first touch driver 181, a secondtouch driver 182, and a touch controller 183. The first touch driver181, the second touch driver 182, and the touch controller 183 may beintegrated into one readout integrated circuit or chip (ROIC).

The first touch driver 181 may select a first touch line through whichthe driving pulse is to be output, based on control by the touchcontroller 183 and may supply the driving pulse to the selected firsttouch line. For example, the driving pulse may be provided in plurality,and the first touch driver 181 may sequentially supply the drivingpulses to the first touch lines T1 to Tj.

The second touch driver 182 may select second touch lines through whichcharging variations of touch sensors are to be received, based oncontrol by the touch controller 183 and may receive the chargingvariations of the touch sensors through the selected second touch lines.The second touch driver 182 may sample the charging variations of thetouch sensors received through the second touch lines R1 to Ri toconvert the charging variations into touch raw data TRD which aredigital data.

The touch controller 183 may generate a Tx setup signal for setting afirst touch line, to which the driving pulse is to be output from thefirst touch driver 181, and an Rx setup signal for setting a secondtouch line through which a touch sensor voltage is to be received by thesecond touch driver 182. Also, the touch controller 183 may generatetiming control signals for controlling the operation timings of thefirst touch driver 181 and the second touch driver 182.

The touch coordinate calculator 190 may receive the touch raw data TRDfrom the touch driver 180. The touch coordinate calculator 190 maycalculate touch coordinates, based on a touch coordinate calculationmethod and may output touch coordinate data HIDxy, including informationabout the touch coordinates, to the host system 170.

The touch coordinate calculator 190 may be implemented with a microcontroller unit (MCU). The host system 170 may analyze the touchcoordinate data HIDxy input from the touch coordinate calculator 190 toexecute an application program associated with coordinates where a touchhas been performed by a user. The host system 170 may transmit thedigital video data DATA and the timing signals to the timing controller160 according to the executed application program.

The touch driver 180 may be included in the source drive ICs 131, or maybe manufactured as a separate driving chip and mounted on the circuitboard 150. Also, the touch coordinate calculator 190 may be manufacturedas a separate driving chip and mounted on the circuit board 150.

FIG. 4 is a cross-section view of one side of the display panel 110 ofFIG. 2.

Referring to FIG. 4, the display panel 110 may include a first substrate111, a second substrate 112, a thin film transistor (TFT) layer 10disposed between the first and second substrates 111 and 112, a lightemitting device layer 20, an encapsulation layer 30, a touch sensinglayer 40, and an adhesive layer 50.

The first substrate 111 may be a plastic film, a glass substrate, or thelike.

The TFT layer 10 may be formed on the first substrate 111. The TFT layer10 may include the scan lines, the data lines, and a plurality of TFTs.The TFTs may each include a gate electrode, a semiconductor layer, asource electrode, and a drain electrode. In a case where the scan driveris provided as the GIP type, the scan driver may be formed along withthe TFT layers 10. The TFT layer 10 will be described below in detailwith reference to FIGS. 8 to 12.

The light emitting device layer 20 may be formed on the TFT layer 10.The light emitting device layer 20 may include a plurality of firstelectrodes, a light emitting layer such as an organic light emittinglayer, a second electrode, and a plurality of banks. The organic lightemitting layer may include a hole transporting layer, a light emittinglayer, and an electron transporting layer. In this case, when a voltageis applied to the first electrode and the second electrode, a hole andan electron move to the light emitting layer through the holetransporting layer and the electron transporting layer and are combinedwith each other in the light emitting layer to emit light. Pixels may beprovided in an area where the light emitting device layer 20 isprovided, and thus, the area where the light emitting device layer 20 isprovided may be defined as a display area. A peripheral area of thedisplay area may be defined as a non-display area. The light emittingdevice layer 20 will be described below in detail with reference toFIGS. 8 and 12.

The encapsulation layer 30 may be formed on the light emitting devicelayer 20. The encapsulation layer 30 prevents oxygen or water frompenetrating into the light emitting device layer 20. The encapsulationlayer 30 may include at least one inorganic layer. A cross-sectionalstructure of the encapsulation layer 30 will be described below indetail with reference to FIGS. 8 and 12.

The touch sensing layer 40 may be formed on the encapsulation layer 30.The touch sensing layer 40 may include first and second touch electrodesfor sensing a user touch, a plurality of bridge electrodes, and aplurality of dummy electrodes. That is, in an embodiment of the presentdisclosure, since the touch sensing layer 40 for sensing a user touch isformed on the encapsulation layer 30, it is not required that a touchscreen device is separately attached on a display device. A planestructure of the touch sensing layer 40 will be described below withreference to FIGS. 5, 6, 7A, and 7B. Also, a cross-sectional structureof the touch sensing layer 40 will be described below in detail withreference to FIGS. 8 and 12.

The adhesive layer 50 may be formed on the touch sensing layer 40. Theadhesive layer 50 may attach the second substrate 112 on the firstsubstrate 111 on which the TFT layer 10, the light emitting device layer20, the encapsulation layer 30, and the touch sensing layer 40 areprovided. The adhesive layer 50 may be an optically clear resin (OCR)layer, an optically clear adhesive (OCA) film, or the like.

The second substrate 112 may act as a cover substrate or a cover window,which covers the first substrate 111. The second substrate 112 may be aplastic film, a glass substrate, an encapsulation film (a protectivefilm), or the like.

FIG. 5 is a plan view illustrating first and second touch electrodes,bridge electrode, and first and second touch lines of a display devicewith integrated touch screen according to an embodiment of the presentdisclosure. FIG. 6 is an enlarged view illustrating in detail an exampleof a region A of FIG. 5. FIG. 7A is a plan view illustrating bridgeelectrodes and dummy electrodes in FIG. 6. FIG. 7B is a plan viewillustrating first and second touch electrodes in FIG. 6.

Referring to FIGS. 5, 6, 7A, and 7B, a plurality of first touchelectrodes TE may be arranged in a first direction (e.g., an X-axisdirection), and a plurality of second touch electrodes RE may bearranged in a second direction (e.g., a Y-axis direction). The firstdirection (the X-axis direction) may be a direction parallel to the scanlines S1 to Sn, and the second direction (the Y-axis direction) may be adirection parallel to the data lines D1 to Dm. Alternatively, the firstdirection (the X-axis direction) may be a direction parallel to the datalines D1 to Dm, and the second direction (the Y-axis direction) may be adirection parallel to the scan lines S1 to Sn.

In order to prevent the first touch electrodes TE and the second touchelectrodes RE from being short-circuited in intersection areastherebetween, the first touch electrodes TE which are adjacent to eachother in the first direction (the X-axis direction) may be electricallyconnected to one another through respective bridge electrodes BE. Thatis, as shown in FIG. 6, the bridge electrodes BE may be connected toadjacent first touch electrodes TE through a plurality of first contactholes CNT1 and may intersect a corresponding second touch electrode RE.A mutual capacitance corresponding to a touch sensor may be generated inan intersection area of each of the first touch electrodes TE and acorresponding second touch electrode RE.

Each of first touch electrodes TE connected to each other in the firstdirection (the X-axis direction) may be spaced apart from andelectrically insulated from first touch electrodes TE adjacent theretoin the second direction (the Y-axis direction). That is, a row of firsttouch electrodes TE that are connected to each other along the firstdirection may be physical and electrically separated from an adjacentrow of first touch electrodes TE. Similarly, each of second touchelectrodes RE connected to each other in the second direction (theY-axis direction) may be spaced apart from and electrically insulatedfrom second touch electrodes RE adjacent thereto in the first direction(the X-axis direction).

A first touch electrode TE, disposed at one side end among a line or rowof first touch electrodes TE connected to each other in the firstdirection (the X-axis direction), may be connected to a first touch lineTL. The first touch line TL may be connected to the first touch driver181 through a pad TP. Therefore, the first touch electrodes TE connectedto each other in the first direction (the X-axis direction) may receivea touch driving signal from the first touch driver 181 through the firsttouch line TL.

A second touch electrode RE, disposed in one side end among a line orcolumn of the second touch electrodes RE connected to each other in thesecond direction (the Y-axis direction), may be connected to a secondtouch line RL. The second touch line RL may be connected to the secondtouch driver 182 through the pad RP. Therefore, the second touch driver182 may receive charging variations of touch sensors of the second touchelectrodes RE connected to each other in the second direction (theY-axis direction).

The bridge electrodes BE may be disposed on a layer which differs from alayer on which the first and second touch electrodes TE and RE aredisposed. The first and second touch electrodes TE and RE may bedisposed on the same layer, and the bridge electrode BE may be disposedon the same layer as a plurality of dummy electrodes DE.

The bridge electrodes BE have a bended structure having a bent or curvedshape, for example, such as “∧”, “∨”, “<” or “>” as well as a barstructure having a straight shape, for example, such as “-” as shown inFIG. 6, but the embodiments of the present disclosure are not limitedthereto. The bridge electrodes BE are not overlapped with the pixel P.Therefore, when the bridge electrodes BE have the bended structure, thebridge electrodes BE may be overlapped with a left first touch electrodeTE, a second touch electrode RE, and a right first touch electrode TE inFIG. 6. Also, when the bridge electrodes BE have the bended structure,the bridge electrodes BE may be formed as a mesh type.

The bridge electrodes BE may be spaced apart from the dummy electrodesDE. Therefore, each of the dummy electrodes DE may be electricallyinsulated from the bridge electrodes BE. Also, the dummy electrodes DEmay be spaced apart and electrically insulated from one another.Furthermore, each of the bridge electrodes BE may be electricallyconnected to one of the first and second touch electrodes TE and RE, buteach of the dummy electrodes DE may be electrically insulated from thefirst and second touch electrodes TE and RE. That is, each of the dummyelectrodes DE may be a floating electrode which is not electricallyconnected to any electrode.

Moreover, the dummy electrodes DE may be provided to overlap the firstand second touch electrodes TE and RE. The term “overlap” is used hereinin the broadest sense and it includes to underlay, underlie, overlay,overlie, either partially or fully, and also that two or more elementsare arranged in an overlapping manner, without otherwise limiting apositional relationship between the two or more elements. For example, afirst element may overlap a second element even in a case where thesecond element is positioned above the first element. The dummyelectrodes DE may be disposed in a layer beneath the layer in which thefirst and second touch electrodes TE and RE are disposed, and the firstand second electrodes TE and RE may be aligned with the underlying dummyelectrodes DE, with the first and second electrodes TE and RE havingsizes and shapes that overlap the underlying dummy electrodes DE.Therefore, the dummy electrodes DE may be hidden by the first and secondtouch electrodes TE and RE, and thus, are not illustrated in the planview of FIG. 6.

Each of the pixels P may be provided in a pentile structure includingone red subpixel R, two green subpixels G, and one blue subpixel B, butis not limited thereto. If each of the pixels P is provided in thepentile structure, the red subpixel R, the green subpixels G, and theblue subpixel B may be provided in an octagonally planar shape, as shownfor example in FIG. 6. In this case, a size of the blue subpixel B maybe largest, and a size of each of the green subpixels G may be smallest.

As described above, according to the present embodiment, since the dummyelectrodes DE are provided on the same layer as the bridge electrodesBE, the bridge electrodes BE are prevented from being over-etched by thedummy electrodes DE. That is, the dummy electrodes DE may be disposedadjacent to the bridge electrodes BE so as to prevent the bridgeelectrodes BE from being over-etched. For example, by positioning thedummy electrodes DE adjacent to the bridge electrodes BE, the dummyelectrodes DE will interact with the etching process to reduce oreliminate a potential for an over-etching condition of the bridgeelectrodes BE during the etching process. Therefore, according to thepresent embodiment, in a case where each of the bridge electrodes BE isprovided in a multi-layer structure including a plurality of electrodes,a side surface of one of the plurality of electrodes is not over-etchedwith respect to another electrode in the multi-layer structure, andthus, the bridge electrode BE is not provided in a reverse taper shape.As a result, according to the present embodiment, an opening which is aregion uncovered by an insulation layer is not provided, and thus, thefirst touch electrode or the second touch electrode is prevented frombeing short-circuited with the bridge electrode BE through the opening.

FIG. 8 is a cross-sectional view illustrating an example taken alongline I-I′ of FIG. 6.

Referring to FIG. 8, a TFT layer 10 may be formed on a first substrate111. The TFT layer 10 may include a plurality of TFTs 210, a gateinsulation layer 220, an interlayer insulation layer 230, a passivationlayer 240, and a planarization layer 250.

A buffer layer may be formed on one surface of the first substrate 111.The buffer layer may be formed on the one surface of the first substrate111, for protecting the TFTs 210 and a plurality of organic lightemitting devices 260 from water penetrating through the first substrate111, which may be vulnerable to penetration of water. The one surface ofthe first substrate 111 may be a surface facing the second substrate112. The buffer layer may be formed of a plurality of inorganic layerswhich are alternately stacked. For example, the buffer layer may beformed of a multilayer where one or more inorganic layers of siliconoxide (SiOx), silicon nitride (SiNx), and SiON are alternately stacked.The buffer layer may be omitted.

The TFTs 210 may be formed on the buffer layer. The TFTs 210 may eachinclude an active layer 211, a gate electrode 212, a source electrode213, and a drain electrode 214. In FIG. 8, the TFTs 210 are exemplarilyillustrated as being formed as a top gate type where the gate electrode212 is disposed on the active layer 211, but is not limited thereto.That is, the TFTs 210 may be formed as a bottom gate type where the gateelectrode 212 is disposed under the active layer 211 or a double gatetype where the gate electrode 212 is disposed both on and under theactive layer 211.

The active layer 211 may be formed on the buffer layer. The active layer211 may be formed of a silicon-based semiconductor material, anoxide-based semiconductor material, and/or the like. A light blockinglayer (not shown) for blocking external light incident on the activelayer 211 may be formed between the buffer layer and the active layer211.

The gate insulation layer 220 may be formed on the active layer 211. Thegate insulation layer 220 may be formed of an inorganic layer, and forexample, may be formed of SiOx, SiNx, or a multilayer thereof.

The gate electrode 212 and a gate line may be formed on the gateinsulation layer 220. The gate electrode 212 and the gate line may eachbe formed of a single layer or a multilayer which includes one ofmolybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti),nickel (Ni), neodymium (Nd), and copper (Cu), or an alloy thereof.

The interlayer insulation layer 230 may be formed on the gate electrode212 and the gate line. The interlayer insulation layer 230 may be formedof an inorganic layer, and for example, may be formed of SiOx, SiNx, ora multilayer thereof.

The source electrode 213, the drain electrode 214, and a data line maybe formed on the interlayer insulation layer 230. Each of the sourceelectrode 213 and the drain electrode 214 may be connected to the activelayer 211 through a contact hole which passes through the gateinsulation layer 220 and the interlayer insulation layer 230. The sourceelectrode 213, the drain electrode 214, and the data line may each beformed of a single layer or a multilayer which includes one of Mo, Al,Cr, Au, Ti, Ni, Nd, and Cu, or an alloy thereof.

The passivation layer 240 for insulating the TFT 220 may be formed onthe source electrode 213, the drain electrode 214, and the data line.The passivation layer 240 may be formed of an inorganic layer, and forexample, may be formed of SiOx, SiNx, or a multilayer thereof.

The planarization layer 250 for planarizing a step height caused by theTFT 210 may be formed on the passivation layer 240. The planarizationlayer 250 may be formed of an organic layer such as acryl resin, epoxyresin, phenolic resin, polyamide resin, polyimide resin, or the like.

The light emitting device layer 20 may be formed on the TFT layer 10.The light emitting device layer 20 may include the organic lightemitting devices 260 and a bank 270.

The organic light emitting devices 260 and the bank 270 may be formed onthe planarization layer 250. The organic light emitting devices 260 mayeach include a first electrode 261, an organic light emitting layer 262,and a second electrode 263. The first electrode 261 may be an anodeelectrode, and the second electrode 263 may be a cathode electrode.

The first electrode 261 may be formed on the planarization layer 250.The first electrode 261 may be connected to the source electrode 213 ofthe TFT 210 through a contact hole which passes through the passivationlayer 240 and the planarization layer 250. The first electrode 261 maybe formed of a metal material, which is high in reflectivity, such as astacked structure (Ti/Al/Ti) of Al and Ti, a stacked structure(ITO/Al/ITO) of Al and ITO, an APC alloy, or a stacked structure(ITO/APC/ITO) of an APC alloy and ITO. The APC alloy may be an alloy ofAg, palladium (Pd), and Cu.

The bank 270 may be formed on the planarization layer 250 to divide thefirst electrode 261, for acting as a pixel defining layer which definesa plurality of pixels P. The bank 270 may be formed to cover an edge ofthe first electrode 261. At least one of the dummy electrode 292 and thebridge electrode 291 may be overlapped with at least a part of the bank270.

Each of the pixels P may denote an area where the first electrode 261corresponding to an anode electrode, the organic light emitting layer262, and the second electrode 263 corresponding to a cathode electrodeare sequentially stacked, a hole from the first electrode 261 and anelectron from the second electrode 263 are combined with each other inthe organic light emitting layer 262 to emit light.

The organic light emitting layer 262 may be formed on the firstelectrode 261 and the bank 270. The organic light emitting layer 262 maybe a common layer which is formed in the pixels P in common, and may bea white light emitting layer which emits white light. In this case, theorganic light emitting layer 262 may be formed in a tandem structureincluding two or more stacks. Each of the stacks may include a holetransporting layer, at least one light emitting layer, and an electrontransporting layer.

Moreover, a charge generating layer may be formed between the stacks.The charge generating layer may include an n-type charge generatinglayer, disposed adjacent to a lower stack, and a p-type chargegenerating layer which is formed on the n-type charge generating layerand is disposed adjacent to an upper stack. The n-type charge generatinglayer may inject an electron into the lower stack, and the p-type chargegenerating layer may inject a hole into the upper stack. The n-typecharge generating layer may be formed of an organic layer where alkalimetal, such as lithium (Li), sodium (Na), potassium (K), or cesium (Cs),or alkali earth metal such as magnesium (Mg), strontium (Sr), barium(Ba), or radium (Ra) is doped on an organic host material having anability to transport electrons. The p-type charge generating layer maybe an organic layer where a dopant is doped on an organic materialhaving an ability to transport holes.

The second electrode 263 may be formed on the organic light emittinglayer 262. The second electrode 263 may be formed to cover the organiclight emitting layer 262. The second electrode 263 may be a common layerwhich is formed in the plurality of pixels P in common.

The second electrode 263 may be formed of a transparent conductivematerial (or TCO), such as indium tin oxide (ITO) or indium zinc oxide(IZO) capable of transmitting light, or a semi-transmissive conductivematerial such as Mg, Ag, or an alloy of Mg and Ag. If the secondelectrode 263 is formed of a semi-transmissive conductive material,emission efficiency may be enhanced by a micro-cavity. A capping layermay be formed on the second electrode 263.

The encapsulation layer 30 may be formed on the light emitting devicelayer 20. The encapsulation layer 30 may include an encapsulation film280.

The encapsulation film 280 may be formed on the second electrode 263.The encapsulation film 280 prevents oxygen or water from penetratinginto the organic light emitting layer 262 and the second electrode 263.To this end, the encapsulation film 280 may include at least oneinorganic film. The inorganic film may be formed of silicon nitride,aluminum nitride, zirconium nitride, titanium nitride, hafnium nitride,tantalum nitride, silicon oxide, aluminum oxide, titanium oxide, and/orthe like.

Moreover, the encapsulation film 280 may further include at least oneorganic film. The organic film may be formed to have a sufficientthickness, for preventing particles from penetrating into the organiclight emitting layer 262 and the second electrode 263 via theencapsulation film 280.

For example, the encapsulation film 280 may include a first inorganicfilm on the second electrode 263, a first organic film on the firstinorganic film, and a second inorganic film on the first organic film.Also, the encapsulation film 280 may further include a third inorganicfilm or a second organic film on the second inorganic film to maintain adistance between bridge electrodes 291 or touch electrodes 294, 295 ofthe touch sensing layer 40 and the second electrode 263 as much as atleast 5 μm. In this case, parasitic capacitances between bridgeelectrodes 291 or touch electrodes 294, 295 of the touch sensing layer40 and the second electrode 263 may be reduced. Therefore, theembodiments of the present disclosure may prevent the second electrode263 from being affected by the coupling between bridge electrodes 291 ortouch electrodes 294, 295 of the touch sensing layer 40 due to theparasitic capacitances.

The touch sensing layer 40 may be formed on the encapsulation layer 30.The touch sensing layer 40 may include a plurality of bridge electrodes291, a plurality of dummy electrodes 292, an insulation layer 293, aplurality of first touch electrodes 294, and a plurality of second touchelectrodes 295. In some embodiments, the touch sensing layer 40 mayfurther include a touch buffer layer formed on the encapsulation film280, in this case, the plurality of bridge electrodes 291, the pluralityof dummy electrodes 292, and the insulation layer 293 may be formed onthe touch buffer layer.

The bridge electrodes 291 and the dummy electrodes 292 may be disposedon the encapsulation film 280. That is, the bridge electrodes 291 andthe dummy electrodes 292 may be disposed on the same layer. The bridgeelectrodes 291 may be spaced apart and electrically insulated from thedummy electrodes 292. Each of the dummy electrodes 292 may be a floatingelectrode which is not electrically connected to any other electrode.

Each of the bridge electrodes 291 and the dummy electrodes 292 may beformed in a multi-layer structure including a plurality of electrodes.For example, each of the bridge electrodes 291 and the dummy electrodes292 may be formed in a three-layer structure of Ti/Al/Ti. The bridgeelectrodes 291 and the dummy electrodes 292 may be formed to overlap atleast part of the bank 270, for preventing an opening region of each ofthe pixels P from being reduced. For example, the bank 270 maycorrespond to a non-light-emitting region, e.g., where the firstelectrode 261 is spaced apart from the organic light emitting layer 262by the bank 270, while the openings of the pixels P correspond to theregions between banks 270 where light is emitted. Thus, by forming thebridge electrodes 291 and dummy electrodes 292 over the bank 270, theopening region of the pixels P is not reduced due to the presence of thebridge electrodes 291 and dummy electrodes 292.

The insulation layer 293 may be formed on the bridge electrodes 291 andthe dummy electrodes 292. First contact holes CNT1 which expose each ofthe bridge electrodes 291 may be formed in the insulation layer 293. Theinsulation layer 293 may be formed of an inorganic layer, and forexample, may be formed of SiOx, SiNx, or a multilayer thereof.

The first and second touch electrodes 294 and 295 may be formed on theinsulation layer 293. That is, the first and second touch electrodes 294and 295 may be formed on the same layer. The first and second touchelectrodes 294 and 295 may be spaced apart and electrically insulatedfrom each other. Each of the first touch electrodes 294 may be connectedto a corresponding bridge electrode 291 through a first contact holeCNT1. Therefore, the first touch electrodes 294 may be connected to eachother by the bridge electrodes 291 in an intersection area of the firstand second touch electrodes 294 and 295, and thus, the first and secondtouch electrodes 294 and 295 are not short-circuited with each other.

Each of the first and second touch electrodes 294 and 295 may be formedin a multi-layer structure including a plurality of electrodes. Forexample, each of the first and second touch electrodes 294 and 295 maybe formed in a three-layer structure of Ti/Al/Ti. The first and secondtouch electrodes 294 and 295 may be formed to overlap at least a part ofthe bank 270, for preventing the opening region of each of the pixels Pfrom being reduced.

A color filter layer may be formed on the insulation layer 293 and thefirst and second touch electrodes 294 and 295. The color filter layermay include a plurality of color filters, disposed to overlap a pixelarea, and a black matrix disposed to overlap the bank 270. In a casewhere the organic light emitting layer 262 includes a plurality oforganic light emitting layers which emit red, green, and blue lights,the color filter layer may be omitted.

An overcoat layer 296 for planarizing a step height caused by the bridgeelectrodes 291, the dummy electrodes 292, and the first and second touchelectrodes 294 and 295 may be formed on the first and second touchelectrodes 294 and 295.

An adhesive layer 50 may be formed on the overcoat layer 296. Theadhesive layer 50 may include an adhesive material 330 and may attachthe second substrate 112 on the first substrate 111 on which the TFTlayer 10, the light emitting device layer 20, the encapsulation layer30, and the touch sensing layer 40 are provided. The adhesive layer 50may be an OCR layer, an OCA film, or the like.

The second substrate 112 may act as a cover substrate or a cover window,which covers the first substrate 111. The second substrate 112 may be aplastic film, a glass substrate, an encapsulation film (a protectivefilm), or the like.

As described above, according to the present embodiment, since the dummyelectrodes 292 are provided on the same layer as the bridge electrodes291, the bridge electrodes 291 are prevented from being over-etched bythe dummy electrodes 292. That is, the dummy electrodes 292 may bedisposed adjacent to the bridge electrodes 291 so as to prevent thebridge electrodes 291 from being over-etched. Therefore, according tothe present embodiment, in a case where each of the bridge electrodes291 is provided in a multi-layer structure including a plurality ofelectrodes, a side surface of one of the plurality of electrodes is notover-etched by another electrode, and thus, is not provided in a reversetaper shape. As a result, according to the present embodiment, the sidesurface of the plurality of electrodes may be provided in a positivetaper shape, and an opening which is a region uncovered by theinsulation layer 293 is not provided, and thus, the first touchelectrode 294 or the second touch electrode 295 is prevented from beingshort-circuited with the bridge electrode 291 through the opening. Asused herein, the term “positive taper shape” refers to a tapered shapewhich is substantially vertical or extends outwardly, for example, froma side of the plurality of electrodes. This is in contrast to thereverse taper shape (or “negative taper shape”) of the bridge electrodesshown in FIG. 1, in which a side surface of the second bridge electrodeBE2 extends inwardly due to over-etching.

FIG. 9 is a flowchart illustrating a method of manufacturing a displaydevice with integrated touch screen according to an embodiment of thepresent disclosure. FIGS. 10A to 10D are cross-sectional views fordescribing a method of manufacturing a display device with integratedtouch screen according to an embodiment of the present disclosure.

Hereinafter, a method of manufacturing a display device with integratedtouch screen according to an embodiment of the present disclosure willbe described in detail with reference to FIGS. 9 and 10A to 10D. Each ofthe steps S101 to S104 shown in the flowchart of FIG. 9 may containmultiple steps and sub-steps.

First, at step S101 of FIG. 9, and with reference to FIG. 10A, a TFTlayer 10, a light emitting device 20, and an encapsulation layer 30 maybe formed on a first substrate 111.

In detail, a buffer layer may be formed on the first substrate 111before forming a TFT 210. The buffer layer is for protecting the TFT 210and an organic light emitting device 260 from water penetrating throughthe first substrate 111 vulnerable to penetration of water and may beformed of a plurality of inorganic layers which are alternately stacked.For example, the buffer layer may be formed of a multilayer where one ormore inorganic layers of SiOx, SiNx, and SiON are alternately stacked.The buffer layer may be formed by a chemical vapor deposition (CVD)process.

Subsequently, an active layer 211 of the TFT 210 may be formed on thebuffer layer. In detail, an active metal layer may be formed on a wholesurface of the buffer layer by using a sputtering process, a metalorganic chemical vapor deposition (MOCVD) process, and/or the like.Subsequently, the active layer 211 may be formed by patterning theactive metal layer through a mask process using a photoresist pattern.The active layer 211 may be formed of a silicon-based semiconductormaterial or an oxide-based semiconductor material.

Subsequently, a gate insulation layer 220 may be formed on the activelayer 211. The gate insulation layer 220 may be formed of an inorganiclayer, and for example, may be formed of SiOx, SiNx, or a multilayerthereof.

Subsequently, a gate electrode 212 of the TFT 210 may be formed on thegate insulation layer 220. In detail, a first metal layer may be formedon a whole surface of the gate insulation layer 220 by using asputtering process, an MOCVD process, and/or the like. Subsequently, thegate electrode 212 may be formed by patterning the first metal layerthrough a mask process using a photoresist pattern. The gate electrode212 may be formed of a single layer or a multilayer which includes oneof Mo, Al, Cr, Au, Ti, Ni, Nd, and Cu, or an alloy thereof.

Subsequently, an interlayer insulation layer 230 may be formed on thegate electrode 212. The interlayer insulation layer 230 may be formed ofan inorganic layer, and for example, may be formed of SiOx, SiNx, or amultilayer thereof.

Subsequently, a plurality of contact holes which pass through the gateinsulation layer 220 and the interlayer insulation layer 230 and exposethe active layer 211 may be formed.

Subsequently, a source electrode 213 and a drain electrode 214 includedin the TFT 210 may be formed on the interlayer insulation layer 230. Indetail, a second metal layer may be formed on a whole surface of theinterlayer insulation layer 230 by using a sputtering process, an MOCVDprocess, and/or the like. Subsequently, the source electrode 213 and thedrain electrode 214 may be formed by patterning the second metal layerthrough a mask process using a photoresist pattern. The source electrode213 and the drain electrode 214 may be connected to the active layer 211through the contact holes which pass through the gate insulation layer220 and the interlayer insulation layer 230. The source electrode 213and the drain electrode 214 may each be formed of a single layer or amultilayer which includes one of Mo, Al, Cr, Au, Ti, Ni, Nd, and Cu, oran alloy thereof.

Subsequently, a passivation layer 240 may be formed on the sourceelectrode 213 and the drain electrode 214 of the TFT 210. Thepassivation layer 240 may be formed of an inorganic layer, and forexample, may be formed of SiOx, SiNx, or a multilayer thereof. Thepassivation layer 240 may be formed by a CVD process.

Subsequently, a planarization layer 250 for planarizing a step heightcaused by the TFT 210 may be formed on the passivation layer 240. Theplanarization layer 250 may be formed of an organic layer such as acrylresin, epoxy resin, phenolic resin, polyamide resin, polyimide resin,and/or the like.

Subsequently, a first electrode 261 included in the organic lightemitting device 260 may be formed on the planarization layer 250. Indetail, a third metal layer may be formed on a whole surface of theplanarization layer 250 by using a sputtering process, an MOCVD process,and/or the like. Subsequently, the first electrode 261 may be formed bypatterning the third metal layer through a mask process using aphotoresist pattern. The first electrode 261 may be connected to thesource electrode 213 of the TFT 210 through a contact hole which passesthrough the passivation layer 240 and the planarization layer 250. Thefirst electrode 261 may be formed of a metal material, which is high inreflectivity, such as a stacked structure (Ti/Al/Ti) of Al and Ti, astacked structure (ITO/Al/ITO) of Al and ITO, an APC alloy, or a stackedstructure (ITO/APC/ITO) of an APC alloy and ITO.

Subsequently, a bank 270 may be formed on the planarization layer 250 tocover an edge of the first electrode 261, for dividing a plurality ofpixels P. The bank 270 may be formed of an organic layer such as acrylresin, epoxy resin, phenolic resin, polyamide resin, polyimide resin,and/or the like.

Subsequently, an organic light emitting layer 262 may be formed on thefirst electrode 261 and the bank 270 through a deposition process or asolution process. The organic light emitting layer 262 may be a commonlayer which is formed in the pixels P in common. In this case, theorganic light emitting layer 262 may be a white light emitting layerwhich emits white light.

If the organic light emitting layer 262 is the white light emittinglayer, the organic light emitting layer 262 may be formed in a tandemstructure including two or more stacks. Each of the stacks may include ahole transporting layer, at least one light emitting layer, and anelectron transporting layer.

Moreover, a charge generating layer may be formed between the stacks.The charge generating layer may include an n-type charge generatinglayer, disposed adjacent to a lower stack, and a p-type chargegenerating layer which is formed on the n-type charge generating layerand is disposed adjacent to an upper stack. The n-type charge generatinglayer may inject an electron into the lower stack, and the p-type chargegenerating layer may inject a hole into the upper stack. The n-typecharge generating layer may be formed of an organic layer where alkalimetal, such as lithium (Li), sodium (Na), potassium (K), or cesium (Cs),or alkali earth metal such as magnesium (Mg), strontium (Sr), barium(Ba), or radium (Ra) is doped on an organic host material having anability to transport electrons. The p-type charge generating layer maybe formed by doping a dopant on an organic material having an ability totransport holes.

Subsequently, a second electrode 263 may be formed on the organic lightemitting layer 262. The second electrode 263 may be a common layer whichis formed in the pixels P in common. The second electrode 263 may beformed of a transparent conductive material (or TCO) such as ITO or IZOcapable of transmitting light. The second electrode 263 may be formedthrough a physical vapor deposition (PVD) process such as a sputteringprocess and/or the like. A capping layer may be formed on the secondelectrode 263.

Subsequently, an encapsulation film 280 may be formed on the secondelectrode 263. The encapsulation film 280 prevents oxygen or water frompenetrating into the organic light emitting layer 262 and the secondelectrode 263. To this end, the encapsulation film 280 may include atleast one inorganic film. The inorganic film may be formed of siliconnitride, aluminum nitride, zirconium nitride, titanium nitride, hafniumnitride, tantalum nitride, silicon oxide, aluminum oxide, titaniumoxide, and/or the like.

Moreover, the encapsulation film 280 may further include at least oneorganic film. The organic film may be formed to have a sufficientthickness, for preventing particles from penetrating into the organiclight emitting layer 262 and the second electrode 263 via theencapsulation film 280, see S101 of FIG. 9.

Second, at step S102 of FIG. 9, and with reference to FIG. 10B, a bridgeelectrode 291 and a dummy electrode 292 of a touch sensing layer 40 maybe formed on the encapsulation layer 30.

In detail, a fourth metal layer may be formed on a whole surface of theencapsulation film 280 by using a sputtering process, an MOCVD process,and/or the like. Subsequently, the bridge electrode 291 and the dummyelectrode 292 may be formed by patterning the fourth metal layer througha mask process using a photoresist pattern. The bridge electrode 291 andthe dummy electrode 292 may be formed in a multi-layer structureincluding a plurality of electrodes, and for example, may be formed in athree-layer structure of Ti/Al/Ti, see S102 of FIG. 9.

Third, at step S103 of FIG. 9, and with reference to FIG. 10C, aninsulation layer 293 covering the bridge electrode 291 and the dummyelectrode 292 may be formed, and a plurality of first contact holes CNT1which pass through the insulation layer 293 and expose the bridgeelectrode 291 may be formed. The insulation layer 293 may be formed ofan inorganic layer, and for example, may be formed of SiOx, SiNx, or amultilayer thereof, see S103 of FIG. 9.

Fourth, at step S104 of FIG. 9, and with reference to FIG. 10D, firstand second touch electrodes 294 and 295 may be formed on the insulationlayer 293.

In detail, a fifth metal layer may be formed on a whole surface of theinsulation layer 293, and in the first contact holes CNT1, by using asputtering process, an MOCVD process, and/or the like. Subsequently, thefirst and second touch electrodes 294 and 295 may be formed bypatterning the fifth metal layer through a mask process using aphotoresist pattern. The first and second touch electrodes 294 and 295may be connected to the bridge electrode 291 through the first contactholes CNT1 passing through the insulation layer 293. The first andsecond touch electrodes 294 and 295 may each be formed in a multi-layerstructure including a plurality of electrodes, and for example, may beformed in a three-layer structure of Ti/Al/Ti.

A color filter layer may be formed on the insulation layer 293 and thefirst and second touch electrodes 294 and 295. The color filter layermay include a plurality of color filters, disposed to overlap a pixelarea, and a black matrix disposed to overlap the bank 270. In a casewhere the organic light emitting layer 262 includes a plurality oforganic light emitting layers which emit red, green, and blue lights,the color filter layer may be omitted.

Moreover, an overcoat layer 296 for planarizing a step height caused bythe bridge electrodes 291, the dummy electrodes 292, and the first andsecond touch electrodes 294 and 295 may be formed on the first andsecond touch electrodes 294 and 295, see S104 of FIG. 9.

Subsequently, by using an adhesive layer 50, the first substrate 111 maybe attached on the second substrate 112. The adhesive layer 50 may be anOCR layer, an OCA film, or the like.

FIG. 11 is an enlarged view illustrating in detail another example ofthe region A of FIG. 5.

Except for that a first touch electrode TE is connected to a dummyelectrode DE through one or more second contact holes CNT2 and a secondtouch electrode RE is connected to a dummy electrode DE through one ormore third contact holes CNT3, the enlarged view of FIG. 11 issubstantially the same as the description given above with reference toFIG. 6. Thus, further detailed description of FIG. 11 is omitted.

FIG. 12 is a cross-sectional view illustrating an example taken alongline II-II′ of FIG. 11.

Except for a touch sensing layer 40, the cross-sectional view of FIG. 12is substantially the same as description given above with reference toFIG. 8. Thus, detailed descriptions of a first substrate 111, a TFTlayer 10, a light emitting device layer 20, an encapsulation layer 30,an adhesive layer 50, and a second substrate 112 are omitted.

Referring to FIG. 12, the touch sensing layer 40 may be formed on theencapsulation layer 30. The touch sensing layer 40 may include aplurality of bridge electrodes 291, a plurality of dummy electrodes 292,an insulation layer 293, a plurality of first touch electrodes 294, anda plurality of second touch electrodes 295.

The bridge electrodes 291 and the dummy electrodes 292 may be disposedon the encapsulation film 280. That is, the bridge electrodes 291 andthe dummy electrodes 292 may be disposed on the same layer. The bridgeelectrodes 291 may be spaced apart from the dummy electrodes 292.

Each of the bridge electrodes 291 and the dummy electrodes 292 may beformed in a multi-layer structure including a plurality of electrodes.For example, each of the bridge electrodes 291 and the dummy electrodes292 may be formed in a three-layer structure of Ti/Al/Ti. The bridgeelectrodes 291 and the dummy electrodes 292 may be formed to overlap thebank 270, for preventing an opening region of a pixel P from beingreduced.

The insulation layer 293 may be formed on the bridge electrodes 291 andthe dummy electrodes 292. First contact holes CNT1 which expose each ofthe bridge electrodes 291 may be formed in the insulation layer 293. Theinsulation layer 293 may be formed of an inorganic layer, and forexample, may be formed of SiOx, SiNx, or a multilayer thereof.

The first and second touch electrodes 294 and 295 may be formed on theinsulation layer 293. That is, the first and second touch electrodes 294and 295 may be formed on the same layer. The first and second touchelectrodes 294 and 295 may be spaced apart and electrically insulatedfrom each other.

Each of the first touch electrodes 294 may be connected to acorresponding bridge electrode 291 through a first contact hole CNT1.Therefore, the first touch electrodes 294 may be connected to each otherby using the bridge electrodes 291 in an intersection area of the firstand second touch electrodes 294 and 295, and thus, the first and secondtouch electrodes 294 and 295 are not short-circuited with each other.

Each of the first touch electrodes 294 may be connected to acorresponding dummy electrode 292 through one or more second contactholes CNT2. Therefore, since the dummy electrodes 292 are electricallyconnected to the first touch electrodes 294, a cross-sectional area ofeach of the first touch electrodes 294 increases. Accordingly, in anembodiment of the present disclosure, a resistance of each of the firsttouch electrodes 294 is reduced.

Each of the second touch electrodes 295 may be connected to acorresponding dummy electrode 292 through a third contact hole (notshown). Therefore, since the dummy electrodes 292 are electricallyconnected to the second touch electrodes 295, a cross-sectional area ofeach of the second touch electrodes 295 increases. Accordingly, in anembodiment of the present disclosure, a resistance of each of the secondtouch electrodes 295 is reduced.

Each of the first and second touch electrodes 294 and 295 may be formedin a multi-layer structure including a plurality of electrodes. Forexample, each of the first and second touch electrodes 294 and 295 maybe formed in a three-layer structure of Ti/Al/Ti. The first and secondtouch electrodes 294 and 295 may be formed to overlap the bank 270, forpreventing the opening region of the pixel P from being reduced.

A color filter layer may be formed on the insulation layer 293 and thefirst and second touch electrodes 294 and 295. The color filter layermay include a plurality of color filters, disposed to overlap a pixel orsubpixel area, and a black matrix disposed to overlap the bank 270. In acase where the organic light emitting layer 262 includes a plurality oforganic light emitting layers which emit red, green, and blue lights,the color filter layer may be omitted.

An overcoat layer 296 for planarizing a step height caused by the bridgeelectrodes 291, the dummy electrodes 292, and the first and second touchelectrodes 294 and 295 may be formed on the first and second touchelectrodes 294 and 295.

FIG. 13 is a flowchart illustrating a method of manufacturing a displaydevice with integrated touch screen according to another embodiment ofthe present disclosure. FIGS. 14A and 14B are cross-sectional views fordescribing a method of manufacturing a display device with integratedtouch screen according to another embodiment of the present disclosure.Each of the steps S201 to S204 shown in the flowchart of FIG. 13 maycontain multiple steps and sub-steps.

Hereinafter, a method of manufacturing a display device with integratedtouch screen according to another embodiment of the present disclosurewill be described in detail with reference to FIGS. 13, 14A, and 14B.

Steps S201 and S202 of FIG. 13 are substantially the same as steps S101and S102 of FIG. 9, and thus, their detailed descriptions are omitted.

At step S203 of FIG. 13, and with reference to FIG. 14A, an insulationlayer 293 covering a bridge electrode 291 and a dummy electrode 292 maybe formed, and a first contact hole CNT1 which passes through theinsulation layer 293 and exposes the bridge electrode 291, secondcontact hole CNT2, and third contact holes (not shown) which expose thedummy electrode 292 may be formed. The insulation layer 293 may beformed of an inorganic layer, and for example, may be formed of SiOx,SiNx, or a multilayer thereof, see S203 of FIG. 13.

Subsequently, at step S204 of FIG. 13, and with reference to FIG. 14B,first and second touch electrodes 294 and 295 may be formed on theinsulation layer 293.

In detail, a fifth metal layer may be formed on a whole surface of theinsulation layer 293, and in the first, second, and third contact holesCNT1 to CNT3, by using a sputtering process, an MOCVD process, and/orthe like. Subsequently, the first and second touch electrodes 294 and295 may be formed by patterning the fifth metal layer through a maskprocess using a photoresist pattern. The first touch electrode 294 maybe connected to the bridge electrode 291 through the first contact holeCNT1 passing through the insulation layer 293. Also, the first touchelectrode 294 may be connected to the dummy electrode 292 through thesecond contact hole CNT2 passing through the insulation layer 293. Also,the second touch electrode 295 may be connected to the dummy electrode292 through the third contact hole (not shown) passing through theinsulation layer 293. The first and second touch electrodes 294 and 295may each be formed in a multi-layer structure including a plurality ofelectrodes, and for example, may be formed in a three-layer structure ofTi/Al/Ti.

A color filter layer may be formed on the insulation layer 293 and thefirst and second touch electrodes 294 and 295. The color filter layermay include a plurality of color filters, disposed to overlap a pixelarea or a subpixel area, and a black matrix disposed to overlap a bank270. In a case where an organic light emitting layer 262 includes aplurality of organic light emitting layers which emit red, green, andblue lights, the color filter layer may be omitted.

Moreover, an overcoat layer 296 for planarizing a step height caused bythe bridge electrode 291, the dummy electrode 292, and the first andsecond touch electrodes 294 and 295 may be formed on the first andsecond touch electrodes 294 and 295, see S204 of FIG. 13.

Subsequently, by using an adhesive layer 50, a first substrate 111 maybe attached on a second substrate 112. The adhesive layer 50 may be anOCR layer, an OCA film, or the like.

As described above, according to the embodiments of the presentdisclosure, since dummy electrodes are provided adjacent to bridgeelectrodes on the same layer as the bridge electrodes, the bridgeelectrodes are prevented from being over-etched by the dummy electrodes.Therefore, according to the embodiments of the present disclosure, in acase where each of the bridge electrodes is provided in a multi-layerstructure including a plurality of electrodes, a side surface of one ofthe plurality of electrodes is not over-etched by another electrode, andthus, is not provided in a reverse taper shape. As a result, accordingto the embodiments of the present disclosure, an opening which is aregion uncovered by an insulation layer is not provided, and thus, afirst touch electrode or a second touch electrode is prevented frombeing short-circuited with a bridge electrode through the opening.

It will be apparent to those skilled in the art that variousmodifications and variations can be made in the present disclosurewithout departing from the spirit or scope of the disclosures. Thus, itis intended that the present disclosure covers the modifications andvariations of this disclosure provided they come within the scope of theappended claims and their equivalents.

The various embodiments described above can be combined to providefurther embodiments. These and other changes can be made to theembodiments in light of the above-detailed description. In general, inthe following claims, the terms used should not be construed to limitthe claims to the specific embodiments disclosed in the specificationand the claims, but should be construed to include all possibleembodiments along with the full scope of equivalents to which suchclaims are entitled. Accordingly, the claims are not limited by thedisclosure.

The invention claimed is:
 1. A display device with integrated touchscreen, the display device comprising: a substrate; first electrodes onthe substrate, the first electrodes spaced apart from neighboring firstelectrodes; a bank disposed between neighboring ones of the firstelectrodes, the bank being on and contacting at feast a part of thefirst electrodes; a light emitting layer on the first electrodes; asecond electrode on the light emitting layer; an encapsulation layer onthe second electrode; a bridge electrode on the encapsulation layer; adummy electrode disposed on the encapsulation layer at an overlappinglocation with the bank; an insulation layer covering the bridgeelectrode on the encapsulation layer; and a first touch electrode and asecond touch electrode on the insulation layer, the first touchelectrode electrically connected to the bridge electrode.
 2. The displaydevice of claim 1, wherein the dummy electrode is overlapped by thefirst touch electrode or the second touch electrode.
 3. The displaydevice of claim 1, wherein the dummy electrode is a floating electrode.4. The display device of claim 1, wherein the first touch electrode isconnected to the bridge electrode through a first contact hole whichpasses through the insulation layer and exposes the bridge electrode. 5.The display device of claim 1, wherein the dummy electrode iselectrically connected with the first touch electrode.
 6. The displaydevice of claim 5, wherein the first touch electrode is connected to thedummy electrode through a second contact hole which passes through theinsulation layer and exposes the dummy electrode.
 7. The display deviceof claim 1, wherein the dummy electrode is electrically connected withthe second touch electrode.
 8. The display device of claim 7, whereinthe second touch electrode is connected to the dummy electrode through athird contact hole which passes through the insulation layer and exposesthe dummy electrode.
 9. The display device of claim 1, wherein at leastone of the dummy electrode and the bridge electrode is overlapped withat least a part of the bank.
 10. The display device of claim 9, whereinthe first and second touch electrodes are overlapped with at least apart of the bank.
 11. The display device of claim 1, wherein each of thebridge electrode and the dummy electrode has a three-layer structure.12. The display device of claim 1, wherein the bridge electrode and thedummy electrode are formed of a same material on the encapsulation layerand are substantially co-planar with one another.
 13. The display deviceof claim 1, wherein each of the first touch electrode and the secondtouch electrode has a three-layer structure, and the first and secondtouch electrodes are formed of a same material on a same layer.
 14. Thedisplay device of claim 1, further comprising an overcoat layer on thefirst and second touch electrodes, the overcoat layer configured toplanarize a step height caused by the bridge electrode, the dummyelectrode, and the first and second touch electrodes.
 15. The displaydevice of claim 1, further comprising a touch buffer layer on theencapsulation layer, wherein the bridge electrode and the dummyelectrode are disposed on and directly contacting the touch bufferlayer.
 16. The display device of claim 1, wherein the bridge electrodehas a mesh shape.
 17. A display device with integrated touch screen, thedisplay device comprising: a substrate; first electrodes on thesubstrate, the first electrodes spaced apart from neighboring firstelectrodes; a bank disposed between respective ones of the firstelectrodes, the bank being on and contacting at least a part of thefirst electrodes; a light emitting layer on the first electrode; asecond electrode on the light emitting layer; an encapsulation layer onthe second electrode; a touch buffer layer on the encapsulation layer; abridge electrode having a multi-layer structure on the touch bufferlayer at an overlapping location with the bank; a dummy electrode on thetouch buffer layer at an overlapping location with the bank; aninsulation layer covering the bridge electrode on the encapsulationlayer; and a first touch electrode and a second touch electrode on theinsulation layer, wherein the bridge electrode is electrically connectedto the first touch electrode, and a side surface of the bridge electrodeis provided in a positive taper shape.
 18. The display device of claim17, wherein the dummy electrode overlaps the first touch electrode orthe second touch electrode.
 19. The display device of claim 17, whereinthe dummy electrode is a floating electrode.
 20. The display device ofclaim 17, wherein the first touch electrode is connected to the bridgeelectrode through a contact hole which passes through the insulationlayer and exposes the bridge electrode.
 21. The display device of claim17, wherein the dummy electrode is electrically connected with the firsttouch electrode.
 22. The display device of claim 21, wherein the firsttouch electrode is connected to the dummy electrode through a contacthole which passes through the insulation layer and exposes the dummyelectrode.
 23. The display device of claim 17, wherein the dummyelectrode is electrically connected with the second touch electrode. 24.The display device of claim 23, wherein the second touch electrode isconnected to the dummy electrode through a contact hole which passesthrough the insulation layer and exposes the dummy electrode.
 25. Thedisplay device of claim 17, wherein at least one of the dummy electrodeand the bridge electrode is overlapped with at least a part of the bank.26. The display device of claim 25, wherein the first and second touchelectrodes are overlapped with at least a part of the bank.
 27. Thedisplay device of claim 17, wherein each of the bridge electrode and thedummy electrode has a three-layer structure.
 28. The display device ofclaim 17, wherein the bridge electrode and the dummy electrode areformed of a same material on aril the touch buffer layer.
 29. Thedisplay device of claim 17, wherein the bridge electrode is a mesh type.30. The display device of claim 1, wherein the dummy electrode isinsulated from the bridge electrode.